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DYNATRON CORPORATION

NEW PRODUCT SPEC SHEET

R-th

0.325

0.294

0.262

0.231

0.200

0.19

0.22

0.25

0.28

0.31

0.34

18 21 24 27 30

Airflow (CFM)

Thermal Resistance (c/w)

R-th

Model Number: G618

• Recommend for Intel® Xeon™ 5500 Series Nehalem EP Processor Model# W5580,

X5570, X5560, X5550, E5540, E5530, E5520, E5506, E5504, E5502, L5520, L5506

• Socket LGA1366

• Passive cooler for 2U Servers & Up

Overall Specification:

• Dimension: 90.0 x 90.0 x 64.0mm

•

Weight: 490g

•

Material: Copper Base with Aluminum Stacked Fin plus 3 Heat Pipes

•

Back Plate is not included

•

Thermal Grease Pre-Printed with GE-Toshiba TIG830SP

•

Support CPU Power up to 130 Watts, with Rca 0.200 C/W refer to 30CFM wind tunnel

air flow

G618 Thermal Performance Chart (VS. Wind Tunnel Airflow):

DYNATRON CORPORATION 1
Model Number: G618 1

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Pagina 1 - Model Number: G618

DYNATRON CORPORATION NEW PRODUCT SPEC SHEET R-th0.3250.2940.2620.2310.2000.190.220.250.280.310.3418 21 24 27 30Airflow (CFM)Thermal Resistance (c/w)

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